At Marvell, we believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology. Trusted by the world's leading technology companies for 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform-for the better.

The data infrastructure that our customers build has never been more critical to our global economy. It's what's keeping the world connected, businesses running, and information flowing. If you're ready to excel, innovate, and truly enjoy your work, apply now for the position detailed below.

The Opportunity

Job Responsibilities:

• Expert in layout design flow, floor planning and layout automation
• Experience with 2.5D package design and development like CoWoS-S and CoWoS-R
• Strong expertise in using IC package layout tools like Cadence APD or Mentor XPD
• Hands-on experience with floor planning tools like Cadence OrbitIO or Synopsis 3DIC
• Knowledge of IC package layout best practices and requirements for high speed data rates
• Well versed in use of constraints manager to enforce layout requirements
• Interface with the IC physical design teams for optimizing the ASIC die floor plan
• Experience in interfacing with Substrate suppliers, OSATs and Silicon fab vendors
• Experience in working with IC package assembly development teams and understanding assembly requirements
• Experience with IC layout tools is highly desired
• Ability to do automation of the layout tasks using scripting
• Power plane design and translating power supply requirements into design
• Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules
• Track record of new product introduction from concept through development and production is a plus
• Knowledge of the thermal and mechanical analysis of the IC package development is a plus
• A team player with strong communication, presentation, and documentation skills
• Previous experience in managing people and deliverables

#LI-DG1

Requirements:

Bachelor's degree in Computer Science, Electrical or Mechanical Engineering or related fields and 10-15 years of related professional experience.
Master's degree and/or PhD in Computer Science, Electrical or Mechanical Engineering or related fields with 5-10 years of experience.

With competitive compensation and great benefits, you will enjoy our workstyle within an incredible culture. We'll give you all the tools you need to succeed so you can grow and develop with us. For additional information on what it's like to work at Marvell, visit our page.

Marvell provides a work environment that promotes employee growth and development. We are searching for an individual who wants to grow with the company and will strive to improve performance. If you are driven, personable, and energetic, there will be additional opportunities for you here at Marvell.

At Marvell, we are doing our part to help keep our communities and our teams safe. As part of our efforts to address the Covid pandemic and future epidemics, you may be required at any time by our policies or applicable laws to provide proof of applicable vaccination or to present negative test results.

This role is eligible for our hybrid work model in which you will be able to split time between working from home and on-site in a Marvell office.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at or 408-222-3604.